Total: 20
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
256Mb(32M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O,QPI
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
104 MHz
24-TBGA