Total: 19
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
256Mb(64M x 4)
2Gb(512M x 4)
128Mb(16M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,DTR
1.65V ~ 2V
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
120 MHz
24-TBGA,CSPBGA
24-TBGA
8-WDFN Exposed Pad