Total: 2
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(64M x 4)
128Mb(16M x 8)
SPI - Four I/O,QPI
1.65V ~ 2V
-40°C ~ 105°C(TA)
120 MHz
24-TBGA
8-WDFN Exposed Pad