Total: 27
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
pipe
256Mb(32M x 8)
2Gb(512M x 4)
128Mb(16M x 8)
2.7V ~ 3.6V
SPI - Four I/O,DTR
-40°C ~ 85°C(TA)
120 MHz
8-SOIC(0.209 ,5.30mm wide)
16-SOIC(0.295 ,7.50mm wide)
24-TBGA,CSPBGA
8-WDFN Exposed Pad