Total: 28
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
4Gb(512M x 8)
32Mb(2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(8M x 16)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C
80 MHz
104 MHz
250µs
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-WDFN Exposed Pad
56-TFSOP(0.724,18.40mm wide)
48-VFBGA
80-VFBGA