Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
128Mb(16M x 8)
1.7V ~ 1.95V
-40°C ~ 85°C
104 MHz
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad