Total: 45
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk,pallet
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(32M x 16)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8,1M x 16)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(8M x 16)
256Mb(32M x 8,16M x 16)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2Gb(256M x 8,128M x 16)
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
1.65V ~ 3.6V
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
100 MHz
166 MHz
108 MHz
133 MHz
66 MHz
80 MHz
90ns
8ms,2.8ms
56-TFSOP(0.724 ,18.40mm wide)
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
48-VFBGA
24-VBGA
8-WLGA