Total: 16
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
108 MHz
8ms,5ms
8-SOIC(0.209,5.30mm wide)