Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
4Mb(512K x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
-40°C ~ 85°C(TA)
75 MHz
104 MHz
85 MHz
15ms,5ms
8-SOIC(0.209,5.30mm wide)