Total: 37
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
512Mb(64M x 8,32M x 16)
1Gb(128M x 8,64M x 16)
64Mb(8M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
-40°C ~ 105°C(TA)
108 MHz
133 MHz
80 MHz
104 MHz
120 MHz
60ns
8ms,2.8ms
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
8-UFDFN Exposed Pad
8-XFDFN Exposed Pad