Total: 21
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pipe
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 105°C(TA)
108 MHz
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
8-WFDFN Exposed Pad