Total: 8
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pipe
4Mb(512k x 8)
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 1.95V
-40°C ~ 105°C(TA)
104 MHz
8-SOIC(0.154,3.90mm wide)
8-WDFN Exposed Pad
8-UFDFN Exposed Pad