Total: 2
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
128Mb(16M x 8)
2.7V ~ 3.6V
SPI - Four I/O,QPI,DTR
-40°C ~ 105°C(TA)
133 MHz
3ms
16-SOIC(0.295,7.50mm wide)