Total: 149
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
pipe
256Mb(32M x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
2Mb(256k x 8)
4Mb(512k x 8)
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
1.65V ~ 1.95V
-40°C ~ 105°C(TA)
133 MHz
80 MHz
104 MHz
3ms
30µs,800µs
60µs,5ms
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UFDFN Exposed Pad
48-VFBGA
8-XFDFN Exposed Pad
8-XDFN Exposed Pad