Total: 87
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
256Mb(32M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
4Mb(512k x 8)
2.7V ~ 3.6V
SPI - Four I/O,QPI
1.65V ~ 2V
1.65V ~ 1.95V
-40°C ~ 105°C(TA)
120 MHz
75 MHz
104 MHz
60µs,5ms
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UFDFN Exposed Pad
8-XDFN Exposed Pad