Total: 197
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
pipe
256Mb(16M x 16)
256Mb(32M x 8)
2Gb(128M x 16)
1Mb(128K x 8)
2Mb(256K x 8)
2Mb(256K x 8,128K x 16)
4Mb(512K x 8)
4Mb(512K x 8,256K x 16)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8,1M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(8M x 16)
512Kb(64K x 8)
16Mb(1M x 16)
128Mb(4M x 32)
256Kb(32K x 8)
2.7V ~ 3.6V
3V ~ 3.6V
4.5V ~ 5.5V
2.3V ~ 2.7V
1.65V ~ 2V
2.4V ~ 2.7V
0°C ~ 70°C(TA)
45 MHz
200 MHz
166 MHz
133 MHz
33 MHz
143 MHz
250 MHz
15ns
70ns
80ns
90ns
45ns
55ns
12ns
8-SOIC(0.154 ,3.90mm wide)
48-TFSOP(0.724 ,18.40mm wide)
32-TFSOP(0.724 ,18.40mm wide)
48-LFBGA,CSPBGA
48-TFBGA,CSPBGA
44-SOIC(0.496 ,12.60mm wide)
650µs
60-TFBGA
48-TFSOP(0.724,18.40mm wide)
mould
32-LCC(J feedthrough)
32-TFSOP(0.724,18.40mm wide)
40-TFSOP(0.724,18.40mm wide)
44-SOIC(0.496,12.60mm wide)
48-TFBGA
64-LBGA
44-SOIC(0.525,13.34mm wide)
54-TSOP(0.400,10.16mm wide)
90-TFBGA
54-TFBGA
66-TSSOP (szerokość 0,400,10,16mm)
50-TSOP(0.400,10.16mm wide)
28-SOIC(0.330,8.38mm wide)