Total: 106
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(4M x 8)
128Mb(16M x 8)
16Mb(512K x 32)
32Mb(1M x 32)
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
1.65V ~ 3.6V
1.65V ~ 2.75V
-40°C ~ 125°C(TA)
100 MHz
166 MHz
40 MHz
75 MHz
108 MHz
133 MHz
66 MHz
80 MHz
56 MHz
24-TBGA
48-TFSOP(0.724,18.40mm wide)
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
8-UDFN Exposed Pad
48-VFBGA
80-BQFP
80-LBGA
8-WFDFN Exposed Pad
24-VBGA
8-WLGA