Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
16Mb(2M x 8)
32Mb(4M x 8)
2.3V ~ 3.6V
-40°C ~ 125°C(TA)
133 MHz
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)