Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pipe
32Mb(4M x 8)
1.7V ~ 1.95V
SPI - Four I/O
-40°C ~ 125°C(TA)
133 MHz
5ms
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
8-XDFN Exposed Pad