Total: 17
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
86 MHz
24-TBGA,CSPBGA
24-TBGA
8-WDFN Exposed Pad