Total: 9
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
1Mb(128K x 8)
8Mb(1M x 8)
512Kb(64K x 8)
2.7V ~ 3.6V
1.65V ~ 3.6V
-40°C ~ 85°C(TA)
100 MHz
8-SOIC(0.154,3.90mm wide)
8-XFDFN Exposed Pad