Total: 11
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
16Mb(512K x 32)
32Mb(1M x 32)
1.65V ~ 3.6V
1.65V ~ 2.75V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 145°C(TA)
40 MHz
mould
80-BQFP
80-LBGA