Total: 2
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
50 MHz
15ms,5ms
8-VDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)