Total: 13
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
512Kb(64K x 8)
1.65V ~ 2V
-40°C ~ 85°C(TA)
50 MHz
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-TSSOP(0.173,4.40mm wide)
8-XFDFN Exposed Pad