Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
75 MHz
3ms
8-SOIC(0.209,5.30mm wide)