Total: 34
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
128Mb(16M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
1.65V ~ 1.95V
-40°C ~ 105°C(TA)
133 MHz
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
24-VBGA