Total: 9
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
32Mb(4M x 8)
1.65V ~ 1.95V
-40°C ~ 105°C(TA)
133 MHz
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)