Total: 12
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
32Mb(8M x 4)
SPI - Four I/O
SPI - Four I/O,QPI
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
133 MHz
8-SOIC(0.209 ,5.30mm wide)
8-SOIC(0.154 ,3.90mm wide)
16-SOIC(0.295 ,7.50mm wide)
8-WDFN Exposed Pad
8-UDFN Exposed Pad