Total: 428
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
TR,CT,
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
2Gb(256M x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(8M x 16)
64Mb(8M x 8)
16Mb(FLASH-NOR),1Gb(FLASH-NAND)(2M x 8(FLASH-NOR),128M x 8(FLASH-NAND))
32Mb(FLASH-NOR),1Gb(FLASH-NAND)(4M x 8(FLASH-NOR),128M x 8(FLASH-NAND))
1.7V ~ 1.95V
2.7V ~ 3.6V
3V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
1.65V ~ 1.95V
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 85°C(TC)
-25°C ~ 85°C(TC)
133 MHz
15ns
3ms
8-XFBGA,WLCSP
8-UFBGA,WLCSP
12-UFBGA,WLCSP
3.5ms
5ms
24-TBGA
63-VFBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UFDFN Exposed Pad
54-VFBGA
32-UFBGA,WLCSP
8-DIP(0.300,7.62mm)
8-WLGA Exposed Pad
90-TFBGA
54-TFBGA
8-XFDFN Exposed Pad
8-XDFN Exposed Pad
21-UFBGA,WLCSP
21-XFBGA,WLCSP