Total: 42
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
1Gb(128M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O,QPI
1.65V ~ 2V
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
133 MHz
3ms
8-SOIC(0.209 ,5.30mm wide)
8-SOIC(0.154 ,3.90mm wide)
16-SOIC(0.295 ,7.50mm wide)
8-XFBGA,WLCSP
12-XFBGA,WLCSP
14-XFBGA,WLCSP
16-UFBGA,WLCSP
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
8-UFDFN Exposed Pad