Total: 19
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
2Gb(256M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
1.65V ~ 2V
2.65V ~ 3.6V
-40°C ~ 85°C(TA)
133 MHz
8-SOIC(0.154 ,3.90mm wide)
24-TBGA,CSPBGA
24-LBGA,CSPBGA
24-TBGA
8-WDFN Exposed Pad