Total: 6
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet,pallet
256Mb(32M x 8)
128Mb(16M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
133 MHz
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)