Total: 46
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
TR,CT,
256Mb(32M x 8)
32Mb(4M x 8)
1.7V ~ 1.95V
SPI - Four I/O
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
133 MHz
12-UFBGA,WLCSP
5ms
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UFDFN Exposed Pad
32-UFBGA,WLCSP
8-XDFN Exposed Pad