Total: 5
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
1.65V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C(TA)
33 MHz
8-UFDFN Exposed Pad