Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR,CT
pallet,pallet
256Mb(16M x 16)
128Mb(16M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-25°C ~ 85°C(TA)
54 MHz
15ms,5ms
8-VDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
84-VFBGA