Total: 84
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
8Mb(1M x 8)
32Mb(2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(8M x 16)
16Mb(512K x 32)
32Mb(1M x 32)
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
1.65V ~ 2.2V
1.65V ~ 3.6V
2.25V ~ 2.75V
1.65V ~ 2.75V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-25°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
-30°C ~ 85°C(TA)
66 MHz
70ns
85ns
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
44-VFBGA
56-VFBGA
79-VFBGA
80-BQFP
80-LBGA
88-TFBGA
88-VFBGA
84-VFBGA