Total: 12
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk,pallet
256Mb(32M x 8)
512Mb(64M x 8)
128Mb(16M x 8)
16Mb(512K x 32)
2.7V ~ 3.6V
1.65V ~ 2.75V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
66 MHz
24-TBGA
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
80-LBGA