Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
2Mb(256K x 8)
16Mb(2M x 8)
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
80 MHz
8-UFDFN Exposed Pad