Total: 14
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
80 MHz
8-WDFN Exposed Pad
8-UDFN Exposed Pad