Total: 138
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
1Gb(256M x 4)
2Gb(256M x 8)
2Gb(512M x 4)
4Gb(512M x 8)
2Mb(256K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
128Mb(8M x 16)
64Mb(8M x 8)
2Mb(256k x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
2.3V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 2V
1.65V ~ 1.95V
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-25°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
104 MHz
24-TBGA,CSPBGA
800µs
5ms
30µs,800µs
250µs
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
84-VFBGA
8-XFDFN Exposed Pad