Total: 44
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
512Kb(64K x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
2.1V ~ 3.6V
1.65V ~ 2.1V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C
104 MHz
8-SOIC(0.154 ,3.90mm wide)
23-UFBGA,WLCSP
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
8-UFDFN Exposed Pad
8-XFDFN Exposed Pad