Total: 62
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
pipe
TR,TR,CT
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
104 MHz
8-SOIC(0.209 ,5.30mm wide)
16-SOIC(0.295 ,7.50mm wide)
24-TBGA,CSPBGA
12-UFBGA,WLCSP
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-XDFN Exposed Pad