Total: 19
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
TR,CT
pipe
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
2.7V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
104 MHz
3ms
8-SOIC(0.154,3.90mm wide)