Total: 5
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
16Mb(2M x 8)
32Mb(4M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 2V
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
104 MHz
12-UFBGA,WLCSP
60µs,5ms