Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
8Mb(1M x 8)
16Mb(2M x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C(TA)
104 MHz
3ms
8-SOIC(0.209,5.30mm wide)