Total: 2
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
8Mb(1M x 8)
4Mb(512k x 8)
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
104 MHz
8-XFBGA,WLCSP
800µs
30µs,800µs