Total: 23
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
CT,
256Mb(16M x 16)
256Mb(32M x 8)
1Gb(64M x 16)
1Gb(128M x 8)
64Mb(4M x 16)
128Mb(8M x 16)
1Gb(32M x 32)
512Mb(16M x 32)
1.7V ~ 1.9V
1.7V ~ 1.95V
2.3V ~ 2.7V
2.7V ~ 2.3V
-40°C ~ 85°C(TA)
-40°C ~ 95°C(TC)
0°C ~ 85°C(TC)
0°C ~ 70°C(TA)
-40°C ~ 85°C(TC)
-25°C ~ 85°C(TC)
200 MHz
15ns
60-TFBGA
84-TFBGA
90-TFBGA
54-TFBGA
66-TSSOP (szerokość 0,400,10,16mm)