Total: 77
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
0°C ~ 70°C(TA)
70ns
48-TFSOP(0.724 ,18.40mm wide)
32-TFSOP(0.724 ,18.40mm wide)
56-TFSOP(0.724 ,18.40mm wide)
64-LBGA,CSPBGA
48-LFBGA,CSPBGA
48-TFBGA,CSPBGA
48-WFBGA,CSPBGA
44-SOIC(0.496 ,12.60mm wide)
32-LCC(J feedthrough)
56-TFBGA,CSPBGA