Total: 9
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
256Mb(16M x 16)
512Mb(32M x 16)
128Mb(8M x 16)
1.7V ~ 2V
2.3V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 85°C(TC)
52 MHz
85ns
64-LBGA
64-TBGA
88-TFBGA,CSPBGA