Total: 4
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
256Mb(32M x 8)
2Gb(256M x 8)
128Mb(16M x 8)
1.7V ~ 2V
-40°C ~ 125°C(TA)
166 MHz
1.8ms
24-TBGA
8-SOIC(0.209,5.30mm wide)